{"id":21347,"date":"2022-08-22T11:04:54","date_gmt":"2022-08-22T03:04:54","guid":{"rendered":"https:\/\/www.meetyoucarbide.com\/?p=21347"},"modified":"2022-08-22T11:05:00","modified_gmt":"2022-08-22T03:05:00","slug":"what-are-the-3-main-pvd-coating-methods","status":"publish","type":"post","link":"https:\/\/www.meetyoucarbide.com\/hi\/what-are-the-3-main-pvd-coating-methods\/","title":{"rendered":"3 \u092e\u0941\u0916\u094d\u092f \u092a\u0940\u0935\u0940\u0921\u0940 \u0915\u094b\u091f\u093f\u0902\u0917 \u0935\u093f\u0927\u093f\u092f\u093e\u0901 \u0915\u094d\u092f\u093e \u0939\u0948\u0902?"},"content":{"rendered":"
Physical vapor deposition coating is an advanced surface treatment technology widely used in the world. Its working principle is to use gas discharge to partially ionize the gas or evaporated substance under vacuum conditions, and deposit the evaporated substance or its reactant on the substrate while the gas ions or evaporated substance ions bombard. At present, the most widely used PVD technology in the market is mainly divided into three categories: magnetron sputtering, multi arc ion plating and vapor deposition.<\/p>\n\n\n\n
Working principle: electrons collide with argon atoms in the process of accelerating to the substrate under the action of electric field, ionizing a large number of argon ions and electrons, and electrons fly to the substrate. Argon ions accelerate the bombardment of the target under the action of the electric field, and a large number of target atoms are splashed out and deposited on the surface of the base layer to form a film layer.<\/p>\n\n\n\n
(1) small particles<\/p>\n\n\n\n
Sputter coating can make the film particles fine, which is suitable for optical grade coating<\/p>\n\n\n\n
(2) low deposition rate<\/p>\n\n\n\n
Sputtering coating is not suitable for industrial coating because of its low deposition rate and low efficiency<\/p>\n\n\n\n
(3) uniform coating<\/p>\n\n\n\n
The sputter coating has the characteristics of small particles and slow deposition, and the high-precision coating can be achieved with appropriate loading mode<\/p>\n\n\n\n
(4) high binding force<\/p>\n\n\n\n
Compared with traditional coating, sputter coating has higher adhesion to substrate<\/p>\n\n\n\n
(5)complicated process<\/p>\n\n\n\n
Sputtering coating requires higher configuration<\/p>\n\n\n\n